Integrated Silicon Metal Systems At The Nanoscale

Integrated Silicon-Metal Systems at the Nanoscale: Applications in Photonics, Quantum Computing, Networking, and Internet is a comprehensive guide to the interaction, materials and functional integration at the nanoscale of the silicon-metal binary system and a variety of emerging and next-generation advanced device applications, from energy and electronics, to sensing, quantum computing and quantum internet networks. The book guides the readers through advanced techniques and etching processes, combining underlying principles, materials science, design, and operation of metal-Si nanodevices. Each chapter focuses on a specific use of integrated metal-silicon nanostructures, including storage and resistive next-generation nano memory and transistors, photo and molecular sensing, harvest and storage device electrodes, phosphor light converters, and hydrogen fuel cells, as well as future application areas, such as spin transistors, quantum computing, hybrid quantum devices, and quantum engineering, networking, and internet. Provides detailed coverage of materials, design and operation of metal-Si nanodevices Offers a step-by-step approach, supported by principles, methods, illustrations and equations Explores a range of cutting-edge emerging applications across electronics, sensing and quantum computing

Silicon technology is evolving rapidly, particularly in board-to-board or chip-to chip applications. Increasingly, the electronic parts of silicon technology will carry out the data processing, while the photonic parts take care of the data communication. For the first time, this book describes the merging of photonics and electronics in silicon and other group IV elements. It presents the challenges, the limitations, and the upcoming possibilities of these developments. The book describes the evolution of CMOS integrated electronics, status and development, and the fundamentals of silicon photonics, including the reasons for its rapid expansion, its possibilities and limitations. It discusses the applications of these technologies for such applications as memory, digital logic operations, light sources, including drive electronics, optical modulators, detectors, and post detector circuitry. It will appeal to engineers in the fields of both electronics and photonics who need to learn more about the basics of the other field and the prospects for the integration of the two. Combines the topics of photonics and electronics in silicon and other group IV elements Describes the evolution of CMOS integrated electronics, status and development, and the fundamentals of silicon photonics

Is Bigger Always Better? Explore the Behavior of Very Small Devices as Described by Quantum Mechanics Smaller is better when it comes to the semiconductor transistor. Nanoscale Silicon Devices examines the growth of semiconductor device miniaturization and related advances in material, device, circuit, and system design, and highlights the use of device scaling within the semiconductor industry. Device scaling, the practice of continuously scaling down the size of metal-oxide-semiconductor field-effect transistors (MOSFETs), has significantly improved the performance of small computers, mobile phones, and similar devices. The practice has resulted in smaller delay time and higher device density in a chip without an increase in power consumption. This book covers recent advancements and considers the future prospects of nanoscale silicon (Si) devices. It provides an introduction to new concepts (including variability in scaled MOSFETs, thermal effects, spintronics-based nonvolatile computing systems, spin-based qubits, magnetoelectric devices, NEMS devices, tunnel FETs, dopant engineering, and single-electron transfer), new materials (such as high-k dielectrics and germanium), and new device structures in three dimensions. It covers the fundamentals of such devices, describes the physics and modeling of these devices, and advocates further device scaling and minimization of energy consumption in future large-scale integrated circuits (VLSI). Additional coverage includes: Physics of nm scaled devices in terms of quantum mechanics Advanced 3D transistors: tri-gate structure and thermal effects Variability in scaled MOSFET Spintronics on Si platform NEMS devices for switching, memory, and sensor applications The concept of ballistic transport The present status of the transistor variability and more An indispensable resource, Nanoscale Silicon Devices serves device engineers and academic researchers (including graduate students) in the fields of electron devices, solid-state physics, and nanotechnology.

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

From the reviews: "...A class in nanoscale science and technology is daunting for the educator, who must organize a large collection of materials to cover the field, and for the student, who must absorb all the new concepts. This textbook is an excellent resource that allows students from any engineering background to quickly understand the foundations and exciting advances of the field. The example problems with answers and the long list of references in each chapter are a big plus for course tutors. The book is organized into seven sections. The first, nanoscale fabrication and characterization, covers nanolithography, self-assembly, and scanning probe microscopy. Of these, we enjoyed the section on nanolithography most, as it includes many interesting details from industrial manufacturing processes. The chapter on self-assembly also provides an excellent overview by introducing six types of intermolecular interactions and the ways these can be employed to fabricate nanostructures. The second section covers nanomaterials and nanostructures. Out of its 110 pages, 45 are devoted to carbon nanotubes. Fullerenes and quantum dots each have their own chapter that focuses on the properties and applications of these nanostructures. Nanolayer, nanowire, and nanoparticle composites of metals and semiconductors are briefly covered (just 12 pages), with slightly more discussion of specific applications. The section on nanoscale electronics begins with a history of microelectronics before discussing the difficulties in shrinking transistor size further. The discussion of problems (leakage current, hot electrons, doping fluctuations, etc.) and possible solutions (high- k dielectrics, double-gate devices) could easily motivate deeper discussions of nanoscale electrical transport. A chapter on molecular electronics considers transport through alkanes, molecular transistors, and DNA in a simple, qualitative manner we found highly instructive. Nanoscale magnetic systems are examined in the fourth section. The concept of quantum computation is nicely presented, although the discussion of how this can be achieved with controlled spin states is (perhaps necessarily) not clear. We found the chapter on magnetic storage to be one of the most lucid in the book. The giant magnetoresistive effect, operation of spin valves, and issues in magnetic scaling are easier to understand when placed in the context of the modern magnetic hard disk drive. Micro- and nanoelectromechanical systems are covered with an emphasis on the integration of sensing, computation, and communication. Here, the student can see advanced applications of lithography. The sixth section, nanoscale optoelectronics, describes quantum dots, organic optoelectronics, and photonic crystals. The chapter on organic optoelectronics is especially clear in its discussion of the fundamentals of this complicated field. The book concludes with an overview of nanobiotechnology that covers biomimetics, biomolecular motors, and nanofluidics. Because so many authors have contributed to this textbook, it suffers a bit from repetition. However, this also allows sections to be omitted without any adverse effect on student comprehension. We would have liked to see more technology to balance the science; apart from the chapters on lithography and magnetic storage, little more than an acknowledgment is given to commercial applications. Overall, this book serves as an excellent starting point for the study of nanoscale science and technology, and we recommend it to anyone with a modest scientific background. It is also a great vehicle to motivate the study of science at a time when interest is waning. Nanotechnology educators should look no further." (MATERIALS TODAY, June 2005)

Fundamentals and Applications of Nano Silicon in Plasmonics and Fullerines: Current and Future Trends addresses current and future trends in the application and commercialization of nanosilicon. The book presents current, innovative and prospective applications and products based on nanosilicon and their binary system in the fields of energy harvesting and storage, lighting (solar cells and nano-capacitor and fuel cell devices and nanoLEDs), electronics (nanotransistors and nanomemory, quantum computing, photodetectors for space applications; biomedicine (substance detection, plasmonic treatment of disease, skin and hair care, implantable glucose sensor, capsules for drug delivery and underground water and oil exploration), and art (glass and pottery). Moreover, the book includes material on the use of advanced laser and proximal probes for imaging and manipulation of nanoparticles and atoms. In addition, coverage is given to carbon and how it contrasts and integrates with silicon with additional related applications. This is a valuable resource to all those seeking to learn more about the commercialization of nanosilicon, and to researchers wanting to learn more about emerging nanosilicon applications. Features a variety of designs and operation of nano-devices, helping engineers to make the best use of nanosilicon Contains underlying principles of how nanomaterials work and the variety of applications they provide, giving those new to nanosilicon a fundamental understanding Assesses the viability of various nanoslicon devices for mass production and commercialization, thereby providing an important source of information for engineers

Aggressive scaling of device and interconnect dimensions has resulted in many low dimensional issues in the nanometer regime. This book deals with various new generation interconnect materials and interconnect modeling and highlights the significance of novel nano interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: Focusses on materials and nanomaterials utilization in next generation interconnects based on Carbon nanotubes (CNT) and Graphene nanoribbons (GNR). Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. Describes Hybrid CNT and GNR based interconnects. Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, nano/microelectronics.