Lead Free Soldering In Electronics
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Lead Free Electronic Solders
Author | : KV Subramanian |
Publsiher | : Springer Science & Business Media |
Total Pages | : 378 |
Release | : 2007-06-28 |
Genre | : Technology & Engineering |
ISBN | : 9780387484334 |
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Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
Lead Free Soldering in Electronics
Author | : Katsuaki Suganuma |
Publsiher | : CRC Press |
Total Pages | : 368 |
Release | : 2003-12-11 |
Genre | : Technology & Engineering |
ISBN | : 0203025776 |
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Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free sold
Lead Free Solder Interconnect Reliability
Author | : Dongkai Shangguan |
Publsiher | : ASM International |
Total Pages | : 292 |
Release | : 2005 |
Genre | : Technology & Engineering |
ISBN | : 9781615030934 |
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A Guide to Lead free Solders
Author | : John W. Evans |
Publsiher | : Springer Science & Business Media |
Total Pages | : 206 |
Release | : 2007-01-05 |
Genre | : Technology & Engineering |
ISBN | : 9781846283109 |
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The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.
Lead Free Soldering
Author | : Jasbir Bath |
Publsiher | : Springer Science & Business Media |
Total Pages | : 299 |
Release | : 2007-06-26 |
Genre | : Technology & Engineering |
ISBN | : 9780387684222 |
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The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.
Fundamentals of Lead Free Solder Interconnect Technology
Author | : Tae-Kyu Lee,Thomas R. Bieler,Choong-Un Kim,Hongtao Ma |
Publsiher | : Springer |
Total Pages | : 253 |
Release | : 2014-11-05 |
Genre | : Technology & Engineering |
ISBN | : 9781461492665 |
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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Lead Free Solders
Author | : Abhijit Kar,Monalisa Char |
Publsiher | : BoD – Books on Demand |
Total Pages | : 96 |
Release | : 2019-10-02 |
Genre | : Technology & Engineering |
ISBN | : 9781789854596 |
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This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.
Implementing Lead Free Electronics
Author | : Jennie S. Hwang |
Publsiher | : McGraw Hill Professional |
Total Pages | : 520 |
Release | : 2004-12-10 |
Genre | : Technology & Engineering |
ISBN | : 0071443746 |
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