Millimeter Wave Low Noise Amplifiers

This book is the first standalone book that combines research into low-noise amplifiers (LNAs) with research into millimeter-wave circuits. In compiling this book, the authors have set two research objectives. The first is to bring together the research context behind millimeter-wave circuit operation and the theory of low-noise amplification. The second is to present new research in this multi-disciplinary field by dividing the common LNA configurations and typical specifications into subsystems, which are then optimized separately to suggest improvements in the current state-of-the-art designs. To achieve the second research objective, the state-of-the-art LNA configurations are discussed and the weaknesses of state-of the art configurations are considered, thus identifying research gaps. Such research gaps, among others, point towards optimization – at a systems and microelectronics level. Optimization topics include the influence of short wavelength, layout and crosstalk on LNA performance. Advanced fabrication technologies used to decrease the parasitics of passive and active devices are also explored, together with packaging technologies such as silicon-on-chip and silicon-on-package, which are proposed as alternatives to traditional IC implementation. This research outcome builds through innovation. Innovative ideas for LNA construction are explored, and alternative design methodologies are deployed, including LNA/antenna co-design or utilization of the electronic design automation in the research flow. The book also offers the authors’ proposal for streamlined automated LNA design flow, which focuses on LNA as a collection of highly optimized subsystems.

Millimeter-Wave Integrated Circuits delivers a detailed overview of MMIC design, specifically focusing on designs for the millimeter-wave (mm-wave) frequency range. The scope of the book is broad, spanning detailed discussions of high-frequency materials and technologies, high-frequency devices, and the design of high-frequency circuits. The design material is supplemented as appropriate by theoretical analyses. The broad scope of the book gives the reader a good theoretical and practical understanding of mm-wave circuit design. It is best-suited for both undergraduate students who are reading or studying high frequency circuit design and postgraduate students who are specializing in the mm-wave field.

This peer-reviewed book explores the methodologies that are used for effective research, design and innovation in the vast field of millimeter-wave circuits, and describes how these have to be modified to fit the uniqueness of high-frequency nanoelectronics design. Each chapter focuses on a specific research challenge related to either small form factors or higher operating frequencies. The book first examines nanodevice scaling and the emerging electronic design automation tools that can be used in millimeter-wave research, as well as the singular challenges of combining deep-submicron and millimeter-wave design. It also demonstrates the importance of considering, in the millimeter-wave context, system-level design leading to differing packaging options. Further, it presents integrated circuit design methodologies for all major transceiver blocks typically employed at millimeter-wave frequencies, as these methodologies are normally fundamentally different from the traditional design methodologies used in analogue and lower-frequency electronics. Lastly, the book discusses the methodologies of millimeter-wave research and design for extreme or harsh environments, rebooting electronics, the additional opportunities for terahertz research, and the main differences between the approaches taken in millimeter-wave research and terahertz research.

This book compiles and presents the research results from the past five years in mm-wave Silicon circuits. This area has received a great deal of interest from the research community including several university and research groups. The book covers device modeling, circuit building blocks, phased array systems, and antennas and packaging. It focuses on the techniques that uniquely take advantage of the scale and integration offered by silicon based technologies.

This peer-reviewed book explores the technologies driving broadband internet connectivity in the fourth industrial revolution (Industry 4.0). It particularly focuses on potential solutions to introduce these technologies in emerging markets and rural areas, regions that typically form part of the digital divide and often have under-developed telecommunications infrastructures, a lack of skilled workers, and geographical restrictions that limit broadband connectivity. Research shows that ubiquitous internet access boosts socio-economic growth through innovations in science and technology, with the common goal of bringing positive change to the lives of individuals. Fifth-generation (5G) networks based on millimeter-wave (mm-wave) frequency information transfer have the potential to provide future-proof, affordable and sustainable broadband connectivity in areas where previous-generation mobile networks were unable to do so. This book discusses the principles of various technologies that enable electronic circuits to operate at mm-wave frequencies. It examines the importance of identifying, describing, and analyzing technology from a purely technological standpoint, but also acknowledges and investigates the challenges and limitations of introducing such technologies in emerging markets. Presenting recent research, the book spearheads participation in Industry 4.0 in these areas.

This book addresses in-depth technical issues, limitations, considerations and challenges facing millimeter-wave (MMW) integrated circuit and system designers in designing MMW wireless communication systems from the complementary metal-oxide semiconductor (CMOS) perspective. It offers both a comprehensive explanation of fundamental theories and a broad coverage of MMW integrated circuits and systems.CMOS Millimeter-Wave Integrated Circuits for Next Generation Wireless Communication Systems is an excellent reference for faculty, researchers and students working in electrical and electronic engineering, wireless communication, integrated circuit design and circuits and systems. While primarily written for upper-level undergraduate courses, it is also an excellent introduction to the subject for instructors, graduate students, researchers, integrated circuit designers and practicing engineers. Advanced readers could also benefit from this book as it includes many recent state-of-the-art MMW circuits.

During the past years, wireless communication systems have been rapidly advancing to meet the high data-rate requirements of various emerging applications. However, the existing transceivers have typically been demonstrated using CMOS-compatible technologies that deliver a relatively low equivalent isotropic radiated power in a small unit cell. Moreover, the particular device characteristics are limiting the linear region for operation. Therefore, the main focus of this dissertation is to present and discuss new design methods for transceivers to solve these issues. To reduce the complexity of the transceiver module for further phased-array scaling, a low-noise power amplifier design approach is designed using a 0.15-μm GaN-on-SiC high-electron mobility transistor technology (HEMT). Utilizing a traded off interstage matching topology between loss and bandwidth, the conversion loss induced by the matching network could be effectively reduced. A stacked-FET configuration was adopted to enhance the power handling of the RF switch. Further improvement on the isolation bandwidth was investigated using theoretical analysis on the intrinsic effect of the passive HEMTs. With the successful implementation of the RF front-end circuits, transceiver modules were integrated on Rogers RO3010 substrate. The planar dual exponentially tapered slot antenna phased-array system showed a compact size with simple biasing network compared to the conventional transceiver approach. The presented T/R module was characterized with an over-the-air test at a distance of 1 m, overcoming the free space path loss of 64 dB. It also shows a high flexibility for further integration with a larger number of array systems, which is very promising for future 5G communication systems.