Proceedings Of The Green Materials And Electronic Packaging Interconnect Technology Symposium
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Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium
Author | : Mohd Arif Anuar Mohd Salleh,Dewi Suriyani Che Halin,Kamrosni Abdul Razak,Mohd Izrul Izwan Ramli |
Publsiher | : Springer Nature |
Total Pages | : 873 |
Release | : 2023-07-02 |
Genre | : Science |
ISBN | : 9789811992674 |
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This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
Electronic Packaging Interconnect Technology
Author | : Kazuhiro Nogita,Mohd Arif Anuar Mohd Salleh,Mohd Mustafa Al Bakri Abdullah,Liyana Jamaludin,Muhammad Faheem Mohd Tahir |
Publsiher | : Trans Tech Publications Ltd |
Total Pages | : 210 |
Release | : 2018-04-13 |
Genre | : Technology & Engineering |
ISBN | : 9783035733242 |
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This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.
Fundamentals of Lead Free Solder Interconnect Technology
Author | : Tae-Kyu Lee,Thomas R. Bieler,Choong-Un Kim,Hongtao Ma |
Publsiher | : Springer |
Total Pages | : 253 |
Release | : 2014-11-05 |
Genre | : Technology & Engineering |
ISBN | : 9781461492665 |
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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Ceramic Interconnect Technology Handbook
Author | : Fred D. Barlow, III,Aicha Elshabini |
Publsiher | : CRC Press |
Total Pages | : 456 |
Release | : 2018-10-03 |
Genre | : Technology & Engineering |
ISBN | : 9781420018967 |
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Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Proceedings of the Symposium on Polymeric Materials for Electronic Packaging and High Technology Applications
Author | : John R. Susko,Randy W. Snyder,Robin A. Susko |
Publsiher | : Unknown |
Total Pages | : 228 |
Release | : 1988 |
Genre | : Electrochemistry |
ISBN | : STANFORD:36105030501303 |
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Proceedings of the Symposium on Packaging of Electronic Devices
Author | : P. Bindra,Robin A. Susko |
Publsiher | : Unknown |
Total Pages | : 266 |
Release | : 1989 |
Genre | : Electronic packaging |
ISBN | : STANFORD:36105030017508 |
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Lead Free Solder Interconnect Reliability
Author | : Dongkai Shangguan |
Publsiher | : ASM International |
Total Pages | : 292 |
Release | : 2005 |
Genre | : Technology & Engineering |
ISBN | : 9781615030934 |
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Advances in Electronic Circuit Packaging
Author | : Gerald A. Walker |
Publsiher | : Springer |
Total Pages | : 342 |
Release | : 2013-12-11 |
Genre | : Technology & Engineering |
ISBN | : 9781489973115 |
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