The Practice Of Tof Sims

Time of flight secondary ion mass spectrometry, TOF-SIMS, is a highly surface sensitive analytical technique that provides information about composition with submicron lateral resolution. For select materials, TOF-SIMS provides unparalleled sensitivity along with excellent reproducibility, and as a mass spectrometric technique, it also provides excellent specificity. Of the analytical methods available, it is among the most surface sensitive, but the physical principles that underlie it are also the least understood. This volume describes the instrumentation, the physical principles behind the technique to the extent they are understood, and provides a practical approach for the interpretation of TOF-SIMS data. The use of advanced data processing methods such as multivariate statistics are described in a readily approachable manner. Given a basic background in undergraduate chemistry and physics, the book will be of use to any student with an interest in the technique.

Time-of-flight secondary ion mass spectrometry (ToF-SIMS) is the most versatile of the surface analysis techniques that have been developed during the last 30 years. This is the Second Edition of the first book ToF-SIMS: Surface analysis by Mass Spectrometry to be dedicated to the subject and the treatment is comprehensive

Adhesives have been used for thousands of years, but until 100 years ago, the vast majority was from natural products such as bones, skins, fish, milk, and plants. Since about 1900, adhesives based on synthetic polymers have been introduced, and today, there are many industrial uses of adhesives and sealants. It is difficult to imagine a product—in the home, in industry, in transportation, or anywhere else for that matter—that does not use adhesives or sealants in some manner. The Handbook of Adhesion Technology is intended to be the definitive reference in the field of adhesion. Essential information is provided for all those concerned with the adhesion phenomenon. Adhesion is a phenomenon of interest in diverse scientific disciplines and of importance in a wide range of technologies. Therefore, this handbook includes the background science (physics, chemistry and materials science), engineering aspects of adhesion and industry specific applications. It is arranged in a user-friendly format with ten main sections: theory of adhesion, surface treatments, adhesive and sealant materials, testing of adhesive properties, joint design, durability, manufacture, quality control, applications and emerging areas. Each section contains about five chapters written by internationally renowned authors who are authorities in their fields. This book is intended to be a reference for people needing a quick, but authoritative, description of topics in the field of adhesion and the practical use of adhesives and sealants. Scientists and engineers of many different backgrounds who need to have an understanding of various aspects of adhesion technology will find it highly valuable. These will include those working in research or design, as well as others involved with marketing services. Graduate students in materials, processes and manufacturing will also want to consult it.

The book provides an up-to-date overview of the fast growing area of Raman spectroscopy. The two-volume work describes how analytic methods using Raman spectroscopy allow for the chemical analysis of materials, providing even spatial resolution without precedent. In addition, external perturbations (strain, temperature, pressure) on molecules and their alignment can be analyzed. Raman spectroscopy can also provide information about the interactions of components, again at a high level of spatial resolution. In the form of tip-enhanced Raman spectroscopy (TERS), the method is a valuable tool for nanotechnology. This book is intended for researchers or lecturers in chemistry and materials science, who are interested in the composition and properties of their samples. It describes how Raman spectroscopy will enable them to examine thin layers, surfaces, and interfaces and improve their knowledge about the properties of composites. In addition, it can serve as a short introduction to vibrational spectroscopy.

This two-volume set describes a flexible and adaptive system-based methodology and associated guidelines for the management and allocation of community-based WELF resources. Over the next 50 years, rapid population, urbanization, and economic growth worldwide will create unprecedented demands for water, energy, land, and food (WELF) resources. The discussion on how to meet human needs for WELF resources and how to guarantee their respective securities has changed over time from looking at all four sectors in isolation to understanding their interdependency through the so-called WELF nexus. The approach presented in this book responds to the overall agreement in the WELF nexus literature that the management and allocation of WELF resources at the community level need to be examined in a more systemic, multidisciplinary, participatory, and practical manner while seeking to increase synergies and reduce trade-offs. This book was written to explore the value proposition of that approach. Volume 1 focuses on defining the landscape in which the nexus operates and outlines the proposed methodology. Volume 2 explores the quantitative and qualitative modeling of the nexus and landscape using system modeling tools including system dynamics. It presents a road map for the formulation, simulation, selection, and ranking of possible intervention plans. The proposed methodology is designed to serve as a guide for different groups involved in the science and policy decision aspects of the WELF nexus within the context of community development. The methodology focuses mostly on WELF-related issues in small-scale and low-income communities where securing resources is critical to their short- and long-term livelihood and development.

Characterization enables a microscopic understanding of the fundamental properties of materials (Science) to predict their macroscopic behaviour (Engineering). With this focus, Principles of Materials Characterization and Metrology presents a comprehensive discussion of the principles of materials characterization and metrology. Characterization techniques are introduced through elementary concepts of bonding, electronic structure of molecules and solids, and the arrangement of atoms in crystals. Then, the range of electrons, photons, ions, neutrons and scanning probes, used in characterization, including their generation and related beam-solid interactions that determine or limit their use, is presented. This is followed by ion-scattering methods, optics, optical diffraction, microscopy, and ellipsometry. Generalization of Fraunhofer diffraction to scattering by a three-dimensional arrangement of atoms in crystals leads to X-ray, electron, and neutron diffraction methods, both from surfaces and the bulk. Discussion of transmission and analytical electron microscopy, including recent developments, is followed by chapters on scanning electron microscopy and scanning probe microscopies. The book concludes with elaborate tables to provide a convenient and easily accessible way of summarizing the key points, features, and inter-relatedness of the different spectroscopy, diffraction, and imaging techniques presented throughout. Principles of Materials Characterization and Metrology uniquely combines a discussion of the physical principles and practical application of these characterization techniques to explain and illustrate the fundamental properties of a wide range of materials in a tool-based approach. Based on forty years of teaching and research, this book incorporates worked examples, to test the reader's knowledge with extensive questions and exercises.

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

This Special Issue “Characterization of Nanomaterials” collects nine selected papers presented at the 6th Dresden Nanoanalysis Symposium, held at Fraunhofer Institute for Ceramic Technologies and Systems in Dresden, Germany, on 31 August 2018. Following the specific motto of this annual symposium “Materials challenges—Micro- and nanoscale characterization”, it covered various topics of nanoscale materials characterization along the whole value and innovation chain, from fundamental research up to industrial applications. The scope of this Special Issue is to provide an overview of the current status, recent developments and research activities in the field of nanoscale materials characterization, with a particular emphasis on future scenarios. Primarily, analytical techniques for the characterization of thin films and nanostructures are discussed, including modeling and simulation. We anticipate that this Special Issue will be accessible to a wide audience, as it explores not only methodical aspects of nanoscale materials characterization, but also materials synthesis, fabrication of devices and applications.