Ulsi Front End Technology

The main focus of this book is ULSI front-end technology. It covers from the early history of semiconductor science & technology from 1874 to state-of-the-art FINFET technology in 2016. Some ULSI back-end technology is also covered, for example, the science and technology of MIM capacitors for analog CMOS has been included in this book. Contents: PrefaceAuthor BiographyIntroduction to the History of SemiconductorsHistory of MOS TechnologyCMOS Switching Speed Characterization and An Overview Regarding How to Speed Up CMOSLow Power CMOS EngineeringAnalog CMOS TechnologyIndex Readership: The book is useful for researchers in semiconductor technology especially practicing engineers. Keywords: Semiconductor;Integrated Circuits;CMOS;High Speed;Low Power;Digital;Analog;Mixed-Signal;Planar Technology;FINFET;MIM CapacitorReview: Key Features: The book is readable for beginnersThe book is useful for semiconductor technology historiansThe book is useful for practicing engineers

"The main focus of this book is ULSI front-end technology. It covers from the early history of semiconductor science & technology from 1874 to state-of-the-art FINFET technology in 2016. Some ULSI back-end technology is also covered, for example, the science and technology of MIM capacitors for analog CMOS has been included in this book."--Publisher's website.

As science pushes closer toward the atomic size scale, new challenges arise to slow the pace of the miniaturization that has transformed our society and fueled the information age. New technologies are necessary to surpass these obstacles and realize the tremendous growth predicted by Moore's law. Assembled from the works of pioneering researchers, Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing presents new developments and technologies for producing the next generation of electronic circuits and displays. This book introduces radical-reaction-based semiconductor manufacturing technologies that overcome the limitations of the existing molecule-reaction-based technologies. It systematically details the procedures and underlying concepts involved in wet process technologies and applications. Following an introduction to semiconductor surface chemical electronics, expert contributors discuss the principles and technology of high-performance wet cleaning; etching technologies and processes; antistatic technology; wet vapor resist stripping technology; and process and safety technologies including waste reclamation, chemical composition control, and ultrapure water and liquid chemical supply systems and materials for fluctuation-free facilities. Currently, large production runs are needed to balance the costs of acquiring and tuning equipment for specialized operating conditions. Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing explains the technologies and processes used to meet the demand for variety and low volumes that exists in today's digital electronics marketplace.

Like most industries around the world, the energy industry has also made, and continues to make, a long march toward “green” energy. The science has come a long way since the 1970s, and renewable energy and other green technologies are becoming more and more common, replacing fossil fuels. It is, however, still a struggle, both in terms of energy sources keeping up with demand, and the development of useful technologies in this area. To maintain the supply for electrical energy, researchers, engineers and other professionals in industry are continuously exploring new eco-friendly energy technologies and power electronics, such as solar, wind, tidal, wave, bioenergy, and fuel cells. These technologies have changed the concepts of thermal, hydro and nuclear energy resources by the adaption of power electronics advancement and revolutionary development in lower manufacturing cost for semiconductors with long time reliability. The latest developments in renewable resources have proved their potential to boost the economy of any country. Green energy technology has not only proved the concept of clean energy but also reduces the dependencies on fossil fuel for electricity generation through smart power electronics integration. Also, endless resources have more potential to cope with the requirements of smart building and smart city concepts. A valuable reference for engineers, scientists, chemists, and students, this volume is applicable to many different fields, across many different industries, at all levels. It is a must-have for any library.

This is the first book to provide guidance on the development and application of metal silicide technology as it emerges from the scientific to the prototype and manufacturing stages. Other key topics covered are fundamentals, present and future silicide technology for Si-based devices, and characterisation methods. Suitable for engineers and students in microelectronics.

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

"This text follows the tradition of Sze's highly successful pioneering text on VLSI technology and is updated with the latest advances in the field of microelectronic chip fabrication. Since computer chips are foundations of modern electronics, these topics are essential for the next generation of USLI technologies, allowing more transistors to be packaged on a single chip. Contributing to each chapter are industry experts, specializing in topics such as epitaxy with low temperature process, rapid thermal processes, low damage plasma reactive ion etching, fine line litography, cleaning technology, clean room technology, packing and reliability."--