Etching Compositions and Processes

Etching Compositions and Processes
Author: M. J. Collie
Publsiher: William Andrew
Total Pages: 328
Release: 1982
Genre: Art
ISBN: UVA:X001400660

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Materials and Processes

Materials and Processes
Author: Barrie D. Dunn
Publsiher: Springer
Total Pages: 667
Release: 2015-12-29
Genre: Technology & Engineering
ISBN: 9783319233628

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The objective of this book is to assist scientists and engineers select the ideal material or manufacturing process for particular applications; these could cover a wide range of fields, from light-weight structures to electronic hardware. The book will help in problem solving as it also presents more than 100 case studies and failure investigations from the space sector that can, by analogy, be applied to other industries. Difficult-to-find material data is included for reference. The sciences of metallic (primarily) and organic materials presented throughout the book demonstrate how they can be applied as an integral part of spacecraft product assurance schemes, which involve quality, material and processes evaluations, and the selection of mechanical and component parts. In this successor edition, which has been revised and updated, engineering problems associated with critical spacecraft hardware and the space environment are highlighted by over 500 illustrations including micrographs and fractographs. Space hardware captured by astronauts and returned to Earth from long durations in space are examined. Information detailed in the Handbook is applicable to general terrestrial applications including consumer electronics as well as high reliability systems associated with aeronautics, medical equipment and ground transportation. This Handbook is also directed to those involved in maximizing the relia bility of new materials and processes for space technology and space engineering. It will be invaluable to engineers concerned with the construction of advanced structures or mechanical and electronic sub-systems.

Siloxanes Advances in Research and Application 2013 Edition

Siloxanes   Advances in Research and Application  2013 Edition
Author: Anonim
Publsiher: ScholarlyEditions
Total Pages: 870
Release: 2013-06-21
Genre: Science
ISBN: 9781481692403

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Siloxanes—Advances in Research and Application: 2013 Edition is a ScholarlyBrief™ that delivers timely, authoritative, comprehensive, and specialized information about ZZZAdditional Research in a concise format. The editors have built Siloxanes—Advances in Research and Application: 2013 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about ZZZAdditional Research in this book to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Siloxanes—Advances in Research and Application: 2013 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.

Plasma Etching Processes for Interconnect Realization in VLSI

Plasma Etching Processes for Interconnect Realization in VLSI
Author: Nicolas Posseme
Publsiher: Elsevier
Total Pages: 128
Release: 2015-04-14
Genre: Technology & Engineering
ISBN: 9780081005903

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This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions. This book focuses on back end of line (BEOL) for high performance device realization and presents an overview of all etch challenges for interconnect realization as well as the current etch solutions proposed in the semiconductor industry. The choice of copper/low-k interconnect architecture is one of the keys for integrated circuit performance, process manufacturability and scalability. Today, implementation of porous low-k material is mandatory in order to minimize signal propagation delay in interconnections. In this context, the traditional plasma process issues (plasma-induced damage, dimension and profile control, selectivity) and new emerging challenges (residue formation, dielectric wiggling) are critical points of research in order to control the reliability and reduce defects in interconnects. These issues and potential solutions are illustrated by the authors through different process architectures available in the semiconductor industry (metallic or organic hard mask strategies). Presents the difficulties encountered for interconnect realization in very large-scale integrated (VLSI) circuits Focused on plasma-dielectric surface interaction Helps you further reduce the dielectric constant for the future technological nodes

Thin Film Materials Processes and Reliability

Thin Film Materials  Processes  and Reliability
Author: Electrochemical Society. Meeting
Publsiher: The Electrochemical Society
Total Pages: 232
Release: 2001
Genre: Thin film devices
ISBN: 1566773571

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CRC Handbook of Metal Etchants

CRC Handbook of Metal Etchants
Author: Perrin Walker,William H. Tarn
Publsiher: CRC Press
Total Pages: 1434
Release: 1990-12-11
Genre: Science
ISBN: 1439822530

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This publication presents cleaning and etching solutions, their applications, and results on inorganic materials. It is a comprehensive collection of etching and cleaning solutions in a single source. Chemical formulas are presented in one of three standard formats - general, electrolytic or ionized gas formats - to insure inclusion of all necessary operational data as shown in references that accompany each numbered formula. The book describes other applications of specific solutions, including their use on other metals or metallic compounds. Physical properties, association of natural and man-made minerals, and materials are shown in relationship to crystal structure, special processing techniques and solid state devices and assemblies fabricated. This publication also presents a number of organic materials which are widely used in handling and general processing...waxes, plastics, and lacquers for example. It is useful to individuals involved in study, development, and processing of metals and metallic compounds. It is invaluable for readers from the college level to industrial R & D and full-scale device fabrication, testing and sales. Scientific disciplines, work areas and individuals with great interest include: chemistry, physics, metallurgy, geology, solid state, ceramic and glass, research libraries, individuals dealing with chemical processing of inorganic materials, societies and schools.

Sulfur Acids Advances in Research and Application 2013 Edition

Sulfur Acids   Advances in Research and Application  2013 Edition
Author: Anonim
Publsiher: ScholarlyEditions
Total Pages: 623
Release: 2013-05-01
Genre: Science
ISBN: 9781490104942

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Sulfur Acids—Advances in Research and Application: 2013 Edition is a ScholarlyEditions™ book that delivers timely, authoritative, and comprehensive information about Sulfinic Acids. The editors have built Sulfur Acids—Advances in Research and Application: 2013 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Sulfinic Acids in this book to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Sulfur Acids—Advances in Research and Application: 2013 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.

Proceedings of the Symposium on Etching for Pattern Definition

Proceedings of the Symposium on Etching for Pattern Definition
Author: Henry G. Hughes,Myron J. Rand
Publsiher: Unknown
Total Pages: 230
Release: 1976
Genre: Integrated circuits
ISBN: UIUC:30112008164987

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