Ulsi Process Integration 9
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ULSI Process Integration 9
Author | : C. Claeys,J. Murota,M. Tao,H. Iwai,S. Deleonibus |
Publsiher | : The Electrochemical Society |
Total Pages | : 335 |
Release | : 2015 |
Genre | : Electronic Book |
ISBN | : 9781607686750 |
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ULSI Process Integration
Author | : Cor L. Claeys |
Publsiher | : The Electrochemical Society |
Total Pages | : 408 |
Release | : 1999 |
Genre | : Integrated circuits |
ISBN | : 1566772419 |
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ULSI Process Integration 6
Author | : C. Claeys |
Publsiher | : The Electrochemical Society |
Total Pages | : 547 |
Release | : 2009-09 |
Genre | : Integrated circuits |
ISBN | : 9781566777445 |
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ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
ULSI Process Integration III
Author | : Electrochemical Society. Meeting |
Publsiher | : The Electrochemical Society |
Total Pages | : 620 |
Release | : 2003 |
Genre | : Technology & Engineering |
ISBN | : 1566773768 |
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ULSI Process Integration II
Author | : Cor L. Claeys,Electrochemical Society. Meeting |
Publsiher | : The Electrochemical Society |
Total Pages | : 636 |
Release | : 2001 |
Genre | : Integrated circuits |
ISBN | : 1566773083 |
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ULSI Process Integration 7
Author | : C. Claeys,H. Iwai,M. Tao,S. Deleonibus,J. Murota |
Publsiher | : The Electrochemical Society |
Total Pages | : 429 |
Release | : 2011 |
Genre | : Electronic Book |
ISBN | : 9781607682615 |
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ULSI Process Integration 5
Author | : Cor L. Claeys |
Publsiher | : The Electrochemical Society |
Total Pages | : 509 |
Release | : 2007 |
Genre | : Integrated circuits |
ISBN | : 9781566775724 |
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The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.
Semiconductor Process Integration 10
Author | : J. Murota,C. L. Claeys,H. Iwai,M. Tao,S. Deleonibus,A. Mai,K. Shiojima,P. Chin |
Publsiher | : The Electrochemical Society |
Total Pages | : 325 |
Release | : 2024 |
Genre | : Electronic Book |
ISBN | : 9781607688211 |
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